Programmable
Precision Plasma
The next control layer in semiconductor manufacturing.
We turn plasma from a fixed process into a controllable system.
Localized Energy
Plasma delivered where it is needed, not everywhere at once.
Real-Time Control
Spatial and temporal precision at nanosecond resolution.
Software Defined
Digital control architecture replaces fixed mechanical tuning.
The industry has hit a control ceiling.
Plasma tools today are fundamentally static.
Control is indirect and slow.
Uniformity is achieved through compromise, not precision.
Process requirements are accelerating. The control architecture is not. Something has to change.
ONX changes the control layer of plasma.
Not better tools. Not incremental gains. A new paradigm.
Localized energy delivery
Plasma directed to defined regions, not broadcast across the chamber.
Real-time spatial control
Dynamic adjustment of plasma behavior during the process, not after.
Programmable plasma behavior
Software defines the physics. Every run is intentional.
This changes everything.
System logic, not incremental improvement.
A proprietary control architecture that makes plasma behavior programmable across the dimensions that define process quality.
Directed Energy Architecture
Plasma energy is delivered to specific locations within the chamber, not broadcast uniformly.
Dynamic Spatial Control
The system adjusts where and how energy interacts with the substrate in real time during the process.
Software-Defined Process Logic
Digital control architecture replaces fixed mechanical tuning. Every parameter is programmable.
This expands what is manufacturable.
Better plasma control connects directly to the metrics that define semiconductor economics.
Yield
Tighter plasma control reduces defect density and improves die-level yield.
Variability
Programmable uniformity eliminates the compromises that cause wafer-to-wafer drift.
New Materials
GaN, SiC, diamond, gallium oxide. Hard materials require precise plasma, not brute force.
Node Transitions
Faster qualification of new processes when the control architecture is already there.
Engineering execution risk, not scientific uncertainty.
Known Physics
Grounded in established RF and plasma science. No speculative breakthroughs required.
Simulation Validated
Core control behaviors confirmed through electromagnetic and plasma modeling.
Hardware Experience
Built by engineers who have designed, built, and shipped real plasma systems.
We target the control layer of plasma processing across deposition and etch.
Every deposition and etch chamber in every fab runs plasma. The control layer that governs how that plasma behaves is the highest leverage point in the process stack.
Even minimal adoption represents a multi-billion dollar opportunity.
Silicon, GaN, SiC, diamond, gallium oxide, advanced thin films. Every material system that depends on plasma processing is a deployment path.
Equipment, licensing, process integration. The business model compounds as the control layer proves out across more materials and more fabs.
This strengthens with scale.
The moat is not a patent. It is the architecture, the methodology, and the data that compounds with every deployment.
System Architecture
The control layer is not a feature. It is a full system design that integrates hardware, firmware, and software into a unified platform.
Control Methodology
Proprietary control methods developed from first principles. The approach is difficult to replicate without the same architectural foundation and deep domain expertise.
Data Accumulation
Every process run generates control data. Over time, this creates a compounding informational advantage that no competitor can shortcut.